Till Dreier, Daniel Nilsson and Julius Hållstedt
Science Direct, Microelectronics Reliability, Volume 168, May 2025, 115694.
Advanced packaging in electronics involves integrating semiconductor devices and sensors into a unified package, often employing complex 3D structures for enhanced performance and efficiency. As electronic components become smaller and more densely packed, conventional 2D X-ray radiography is not sufficient for inspection. Here we demonstrate the use of nano-CT with a high bandwidth memory (HBM) example illustrating the potential of fast detection of sub-micron voids and cracks in micro-bumps. Using a 30 s overview scan at 2.6 μm voxel size for navigation, a region is selected for a high-resolution scan with a voxel size of 600 nm to analyse 20 μm micro-bumps in between DRAM layers. Additionally, high-resolution laminography is performed showing the differences of the 2 techniques. The results show how high-resolution nano-CT can effectively be used for fast failure analysis and R&D as well as important feedback to production ramp up and yield improvements of advanced packaging technologies.
