Hybrid Bonding Symposium
Date/Time
Date(s) - January 16, 2025 - January 17, 2025
All Day
Excillum will attend the Hybrid Bonding Symposium, hosted by SEMI International, Silicon Valley, CA USA.
Listen to Julius Hållstedts talk, Friday Jan. 17 at 15:00 (PST): “Metrology for Hybrid Bonds, Microbumps and TSVs in Advanced Packaging – Are X-ray Methods Up to the Task?”. Attendance is possible on site or virtual. Sign up on the conference website.
