Hybrid bonds
A commercially available AMD Ryzen 7 5800X3D was investigated. This device assembly utilizes hybrid bonds to attach SRAM cache memory vertically atop the processing core. The hybrid bonds are 1.5 µm in diameter at 9 µm pitch and approximately 15 µm length. Due to the small size and tight pitch hybrid bonds are considered challenging for X-ray investigation.
In this investigation the NanoTube N3 was used in nanoCT setup. Measurements was done with 300 nm voxels and a total 6 h scan time. As seen from the virtual slice and 3D render, the individual bonds and Cu pads are clearly visible demonstrating that 3D X-ray can be used also for hybrid bond inspection.
