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Publications

Fast and high-resolution X-ray nano tomography for failure analysis in advanced packaging

Till Dreier, Daniel Nilsson and Julius Hållstedt Science Direct, Microelectronics Reliability, Volume 168,  May 2025,…
Webinars

Battery quality control from first principles

Peter Attia, cofounder and CTO of Glimpse, discusses how to approach battery quality control from…
Press releases

Excillum and Techvalley expand partnership to revolutionize battery inspection

March 31, 2025 - Excillum and Techvalley announce that they are expanding their collaboration to…
Webinars

Metrology for hybrid bonds, microbumps and TSVs in advanced packaging – are X-ray methods up to the task?

Julius Hållstedt, Excillum, talks about how high-resolution X-ray methods will become increasingly important to support…
Press releases

Excillum launches MetalJet F1016

March 4, 2025 - MetalJet F1016 combines unparalleled speed, precision and versatility to meet the…
Videos

Introducing MetalJet F – Brighter. Faster. Smarter.

The next generation of high-performance microfocus X-ray sources is here. The result of twenty years…
Videos

What can be even brighter, faster and smarter?

Innovation is about to take a giant leap forward. Yet again, we're redefining the X-ray…
Articles

Advent calendar 2024

Unwrap exciting stories and insights every day up until December 25th - here or on…
Press releases

Excillum and Pinnacle establish demonstrator for high-speed X-ray inspection

November 20, 2024 - Unmatched throughput and resolution CT X-ray system made available for the…
Press releases

Excillum wins E-Mobility Process Innovation award

October 28, 2024 - The E-Mobility Production Awards recognize players who are producing promising approaches…
Press releases

Excillum and TechValley secure first project to provide extreme resolution X-ray inspection of electronics

July 8, 2024 - Excillum and TechValley announce that they have formed a partnership and…
Videos

High resolution non-destructive nano-CT of 3D package

Investigation of a 3D package with hollow core through package vias (TPV) and 3D redistribution…