Semi/electronics Archives

Webinars

March 24, 2025

Metrology for hybrid bonds, microbumps and TSVs in advanced packaging – are X-ray methods up to the task?

Julius Hållstedt, Excillum, talks about how high-resolution X-ray methods will become increasingly important to support…

Ingrid Aksnes

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Press releases

March 4, 2025

Excillum launches MetalJet F1016

March 4, 2025 - MetalJet F1016 combines unparalleled speed, precision and versatility to meet the…

Ingrid Aksnes

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Press releases

October 28, 2024

Excillum wins E-Mobility Process Innovation award

October 28, 2024 - The E-Mobility Production Awards recognize players who are producing promising approaches…

Ingrid Aksnes

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Press releases

July 8, 2024

Excillum and TechValley secure first project to provide extreme resolution X-ray inspection of electronics

July 8, 2024 - Excillum and TechValley announce that they have formed a partnership and…

Ingrid Aksnes

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Videos

June 16, 2024

High resolution non-destructive nano-CT of 3D package

Investigation of a 3D package with hollow core through package vias (TPV) and 3D redistribution…

Ingrid Aksnes

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Videos

June 15, 2024

Hybrid bonds

A commercially available AMD Ryzen 7 5800X3D was investigated. This device assembly utilizes hybrid bonds…

Ingrid Aksnes

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Videos

June 14, 2024

Multi-layer ceramic capacitors (MLCC)

By utilizing the Excillum NanoTube N3 in a nanoCT (3D X-ray) setup it is possible…

Ingrid Aksnes

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Videos

June 13, 2024

Extreme resolution 3D X-ray for advanced packaging

A commercial GPU with HBM is analysed using the Excillum NanoTube N3 X-ray source in…

Ingrid Aksnes

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Articles

April 24, 2024

Sharper scans, faster ramp-up

How a leap forward in X-ray resolution can drive development and boost yield in advanced…

Ingrid Aksnes

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Webinars

March 29, 2022

Increasing throughput and resolution of industrial X-ray inspection

Björn Hansson, CTO Excillum, talks about the MetalJet E1+ and the NanoTube N3 for industrial…

Ingrid Aksnes

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Semi/electronics Archives - Excillum

Metrology for hybrid bonds, microbumps and TSVs in advanced packaging – are X-ray methods up to the task?

Excillum launches MetalJet F1016

Excillum wins E-Mobility Process Innovation award

Excillum and TechValley secure first project to provide extreme resolution X-ray inspection of electronics

High resolution non-destructive nano-CT of 3D package

Hybrid bonds

Multi-layer ceramic capacitors (MLCC)

Extreme resolution 3D X-ray for advanced packaging

Sharper scans, faster ramp-up

Increasing throughput and resolution of industrial X-ray inspection

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